Tuesday, 05 September 2023 16:10

Emerson to showcase Floor to Cloud™packaging solutions at PACK EXPO 2023

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Global technology, software and engineering leader Emerson will exhibit its Floor to CloudTM packaging solutions at PACK EXPO Las Vegas, September 11-13, 2023. As the future of automation, Floor to Cloud solutions empower smarter packaging lines and more efficient processes that make it possible for manufacturers to continuously improve plant productivity, sustainability and safety.

Visitors to South Lower Hall, Booth 6107, can view highlights from the comprehensive Floor to Cloud portfolio, which includes AVENTICSTM, BransonTM, MoviconTM, PACEdge and PACSystemsTM solutions. Packaging automation experts will demonstrate how a Floor to Cloud approach unlocks trapped data and connects islands of automation, giving manufacturers the visibility and control to solve critical challenges and ambitious goals. Attendees will learn how to improve overall equipment effectiveness (OEE), increase energy efficiency while reducing waste, and create safer operations and digital record keeping.

Emerson will also be highlighted as an industry expert in the new Sustainability Central presented by PMMI and curated by Fuseneo. Located in North Hall (Booth N-9455), Sustainability Central is an interactive experience that demonstrates how manufacturers can achieve packaging sustainability.

Movicon.NExT™ HMI/SCADA is a highly modular, highly scalable platform that goes beyond SCADA to solve automation problems for both CPGs and original equipment manufacturers (OEMs), from the single machine level to a complete plantwide IIoT project implementation. Among Movicon.NExT modules, Movicon Pro.Lean™ provides performance data and analytics for evaluations of overall equipment effectiveness (OEE) and Movicon Pro.Energy™ measures and tracks consumption, while the advanced Movicon NExT.AR solves operational problems through visualization tools that allow personnel to evaluate previously unreachable equipment. For maximum flexibility, Emerson also provides Movicon WebHMI, an HTML5-based visualization tool that can be used as a stand-alone HMI product running on Windows or Linux operator panels, or as a Web Client for Movicon.NExT SCADA applications, as well as Connext™, an industrial protocol gateway.

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Presentation and event highlights:
In addition to showcasing its advanced Floor to Cloud packaging automation solutions, Emerson will also sponsor two events, the annual Packaging & Processing Women’s Leadership Network (PPWLN) breakfast and the Amazing Packaging Race.

All women who are registered for PACK EXPO Las Vegas are invited to the free PPWLN breakfast and program on Tuesday, September 12, at 7:30 a.m. in Room N-247. Following the breakfast, attendees will have the opportunity for a private show floor tour and participate in a Q&A with Lisa Propati, Vice President and General Manager of Weiler Labeling Systems, as well as other packaging executives.

As part of the Amazing Packaging Race, teams from U.S. colleges, trade schools and universities race to complete tasks and solve problems at booths across the PACK EXPO Las Vegas show floor.

Product highlights:
AVENTICS Series Advanced Electronic System (AES) With Integrated OPC UA

The award-winning AVENTICS Series Advanced Valve (AV) system with Advanced Electronic System (AES) is the first pneumatic valve system with an integrated Open Platform Communications Unified Architecture (OPC UA). The AES helps interoperability challenges and accesses data more easily, while the digital twin integration improves productivity efficiency and reduces costs. In 2022, the AVENTICS Series AV system with Advanced AES won an Endeavor IDEA! Award, earned silver in the LEAP Awards and was named a finalist for the NED Innovation Awards.


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